The **ATS-01D-91-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Thermal Resistance (Flowing)** | 21.97°C/W (@ 100 LFM) | | **Thermal Resistance (Static)** | 6.02°C/W (@ 100 LFM) | --- ## 2. Key Electronic Features ### A. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a **push-pin and spring mechanism**. This provides: * **Constant Pressure:** Ensures a reliable interface between the heat sink and the electronic component (TIM - Thermal Interface Material). * **Mechanical Stability:** Prevents the heat sink from shifting due to vibration or shock. ### B. Thermal Performance The "C2" in the part number indicates a specific thermal performance profile. * **Fin Design:** It uses a high-density fin structure to increase surface area, allowing for efficient heat transfer into the surrounding air. * **Thermal Interface Material (TIM):** It typically comes pre-applied with **T766**, a high-performance phase-change material that fills microscopic air gaps between the component and the heat sink. ### C. Material and Coating * **Aluminum Construction:** Offers a lightweight solution with high thermal conductivity. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly improves radiant heat emission. --- ## 3. Common Applications This specific heat sink is typically used in space-constrained electronic environments: 1. **Network Switches/Routers:** Cooling integrated circuits (ICs). 2. **Embedded Systems:** For industrial PC boards. 3. **Power Supplies:** Cooling voltage regulators or MOSFETs. 4. **FPGA/ASIC Cooling:** Protecting custom logic chips from overheating. ---