The **ATS-01D-90-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. These components are critical for maintaining the operational temperature of semiconductors like CPUs, GPUs, or FPGAs. --- ### 1. Key Technical Specifications Below are the electronic and physical properties of this specific heatsink model: | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-01D-90-C2-R0 | | **Material** | Aluminum (High Performance) | | **Thermal Resistance** | 6.36°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Attachment Type** | Push-Pin (Plastic/Brass) | | **Interface Material** | T766 (Thermal Grease) | | **Fin Style** | Straight Fin | --- ### 2. Electronic Component Breakdown #### A. Thermal Management Strategy This part is designed for **forced air cooling**. In electronic circuits, thermal resistance ($R_{th}$) is the equivalent of electrical resistance. The lower the °C/W value, the better the part is at dissipating heat away from sensitive electronic junctions to the ambient air. #### B. Push-Pin Attachment Mechanism Instead of using messy adhesives or permanent solder, this part uses a mechanical push-pin system. This is crucial for: * **Uniform Pressure:** Ensures consistent contact between the heatsink base and the chip surface. * **Vibration Resistance:** Securely locks the heatsink to the PCB holes, preventing movement during shipping or operation. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates it comes pre-applied with **T766 thermal grease**. * **Function:** It fills microscopic air gaps between the heatsink and the electronic component. * **Benefit:** Reduces "Contact Resistance," which is often the biggest bottleneck in electronic cooling. --- ### 3. Application Use Cases This specific size and thermal profile are commonly found in the following electronic environments: 1. **Network Switches/Routers:** Cooling high-speed processing chips. 2. **Embedded Systems:** Industrial PCs where high-height (25mm) fins are permissible for better airflow. 3. **Power Supplies:** Managing heat for MOSFETs or Voltage Regulators. ---