The **ATS-01D-87-C2-R0** is a specific model of a **High-Performance Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components, primarily integrated circuits (ICs) like CPUs, GPUs, or FPGAs. ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Heat Sink Type** | Straight Fin | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 35mm x 35mm x 20mm | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 13.16°C/W (at 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Component Breakdown The assembly consists of four primary "parts" that work together to provide cooling and stability: #### A. The Heat Sink Body * **Material:** Made of high-grade aluminum for high thermal conductivity. * **Design:** Features a "straight fin" profile. This design is optimized for environments with consistent airflow (forced convection), allowing air to travel smoothly between the fins to carry heat away. #### B. The Push-Pin Attachment * **Mechanism:** Uses a brass push-pin mechanism combined with a compression spring. * **Purpose:** This ensures "high-pressure" contact between the heat sink and the electronic chip, which is critical for maximizing heat transfer. #### C. Thermal Interface Material (TIM) * **Material:** It comes pre-applied with **T766**. * **Function:** The TIM fills microscopic air gaps between the surface of the electronic component and the bottom of the heat sink. Air is a poor conductor, so the TIM is essential for reducing thermal resistance. #### D. Finish (Blue Anodized) * **Function:** The blue anodized coating is not just for aesthetics; it provides corrosion resistance and increases surface emissivity, which slightly improves radiative cooling. --- ### 3. Usage Context This part is commonly used in: 1. **Telecommunications:** Cooling networking switches or routers. 2. **Embedded Systems:** Industrial PCs where high reliability is required. 3. **Prototyping:** Used on development boards where a component exceeds its safe operating temperature under load.