The **ATS-01D-86-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is designed for cooling electronic components, specifically those in BGA (Ball Grid Array) packages. --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-01D-86-C2-R0 | | **Heat Sink Type** | Push-Pin (Passive Heat Sink) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W x H)** | 35mm x 35mm x 15mm | | **Fin Style** | Straight Fin | --- ### Key Electronic & Thermal Characteristics #### 1. Thermal Resistance Thermal resistance indicates how effectively the part moves heat away from the semiconductor. * **Forced Convection:** At 200 LFM (Linear Feet per Minute), the thermal resistance drops significantly, allowing the electronic component to run at high clock speeds without thermal throttling. * **Natural Convection:** Without a fan, the resistance is higher, suitable only for low-power chips. #### 2. Attachment System (Push-Pin) Unlike adhesive-based heat sinks, the **C2-R0** series uses a push-pin system. This provides: * **Constant Pressure:** A brass or plastic pin with a compressed spring ensures consistent contact between the heat sink and the chip. * **Reliability:** It is more vibration-resistant than thermal tape, making it ideal for industrial or automotive electronics. #### 3. Material Properties * **Aluminum 6063:** This alloy is used for its high thermal conductivity and lightweight properties. * **Blue Anodizing:** This isn't just for aesthetics; the anodized layer increases thermal emissivity and provides a layer of electrical insulation/corrosion resistance. --- ### Common Applications The ATS-01D-86-C2-R0 is typically used on components that generate moderate to high heat within a 35mm footprint: * **FPGA & ASIC:** High-speed processing units. * **CPUs/GPUs:** Small form-factor embedded processors. * **Network Switches:** Cooling for high-bandwidth controller chips. --- ### Installation Note To function correctly, this heat sink requires a **Thermal Interface Material (TIM)** such as thermal grease or a thermal pad between the base of the heat sink and the top of the electronic component.