The **ATS-01D-85-C2-R0** is a high-performance thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. Specifically, it is a push-pin heat sink designed for cooling electronic components such as CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 10.0mm | | **Thermal Resistance** | 8.98°C/W (Unducted Flow @ 200 LFM) | | **Fin Style** | Straight (Fine Pitch) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Electronic Features While the device itself is mechanical, its "electronic" relevance pertains to how it interacts with and protects PCB components: #### A. Thermal Performance The heat sink utilizes a **straight-fin design** which is optimized for high-density electronic assemblies. The low thermal resistance (measured in °C/W) ensures that heat is efficiently pulled away from the silicon die, preventing thermal throttling and component failure. #### B. Attachment Mechanism (Push-Pin) * **Secure Mounting:** Uses brass push-pins with a reliable compression spring. * **PCB Compatibility:** Requires pre-drilled holes in the PCB. The spring tension ensures consistent pressure on the component, which is critical for the effectiveness of the Thermal Interface Material (TIM). * **Vibration Resistance:** Unlike adhesive-based heat sinks, the push-pin method is resistant to mechanical shocks and vibrations common in industrial electronics. #### C. Thermal Interface Material (T766) The part comes with **T766 phase-change material** pre-applied. In electronics, this material fills microscopic air gaps between the heat sink and the component surface, significantly reducing contact resistance once the component reaches operating temperature. --- ### 3. Applications * **Network Switches & Routers:** Cooling high-speed processing chips. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators. * **Embedded Systems:** Protecting microcontrollers in compact enclosures. ---