The **ATS-01D-84-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, which is engineered for secure and efficient cooling of electronic integrated circuits (ICs). --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 30.00 mm x 30.00 mm | | **Height (H)** | 35.00 mm | | **Pitch** | Fine Pitch | | **Pattern** | Straight Fin | | **Thermal Resistance** | 6.96 °C/W (@ 100 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | --- ### 2. Key Electronic & Mechanical Components #### A. Fin Design (Fine Pitch) The part utilizes a **Straight Fin** geometry. In electronic cooling, "Fine Pitch" refers to the density of the fins. Higher density increases the surface area available for heat dissipation, making it ideal for high-speed airflow environments within server racks or telecommunications equipment. #### B. PushPIN™ Attachment System Unlike adhesive-based heat sinks, the ATS-01D-84-C2-R0 uses a mechanical attachment system consisting of: * **Brass Push Pins:** These snap into pre-drilled holes on the Printed Circuit Board (PCB). * **Stainless Steel Springs:** These provide consistent "Force" or pressure (compression) on the electronic component (CPU/GPU/FPGA), ensuring a tight interface for maximum thermal transfer. #### C. Thermal Interface Material (TIM) This specific part number typically comes pre-applied with **T412 Phase Change Material**. This is an "electronic part" in chemical form that fills microscopic air gaps between the chip and the heatsink to lower thermal impedance. --- ### 3. Application Use Cases This component is generally used for cooling mid-to-high power electronic devices such as: 1. **Microprocessors & FPGAs:** Where localized heat density is high. 2. **Power Supplies:** To dissipate heat from MOSFETs or voltage regulators. 3. **Network Switches:** Where vertical height (35mm) allows for significant convective cooling. ---