công cụ tìm kiếm bảng dữ liệu linh kiện điện tử
  Vietnamese  ▼
ALLDATASHEET.VN

X  

  • ATS-01D-82-C2-R0

  • AI
    The **ATS-01D-82-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components like integrated circuits (ICs), CPUs, or high-power transistors. --- ### 1. Technical Specifications The part number defines its physical and thermal characteristics. Below are the primary specifications: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 24.97°C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 30mm x 30mm x 25mm | | **Fin Style** | Straight Fin (High Density) | | **Thermal Interface** | T766 (Phase change material/Grease) | --- ### 2. Design and Engineering Details #### A. pushPIN™ Attachment System This component features a specialized mechanical attachment system. Instead of using messy adhesives or simple clips, it uses pre-assembled **spring-loaded push pins**. * **Benefits:** Ensures consistent pressure (clamping force) for optimal heat transfer and prevents the heat sink from shifting during vibration. * **Compatibility:** Designed for PCB holes with a specific diameter (usually 3.175mm). #### B. Thermal Performance The "Straight Fin" design is optimized for airflow. The performance varies significantly based on the air velocity (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural) | 24.97 | | 300 | 9.09 | | 500 | 6.22 | #### C. Material & Coating * **Aluminum:** Provides a lightweight solution with high thermal conductivity. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer increases the surface emissivity, which slightly improves radiative cooling and provides corrosion resistance. --- ### 3. Application Use Cases This heat sink is typically found in: 1. **Telecommunications:** Cooling FPGA and ASIC chips in routers or switches. 2. **Embedded Systems:** Industrial PCs where space is limited but vertical height (25mm) is available. 3. **Power Electronics:** Cooling MOSFETs or voltage regulators that generate localized heat. --- ### 4. Part Number Breakdown The nomenclature for **ATS-01D-82-C2-R0** can be decoded as follows: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **01:** Series designation. * **D:** Attachment type (pushPIN™). * **82:** Specific fin and base geometry. * **C2:** Blue Anodized finish. * **R0:** Revision/Packaging code.
    ✨ Follow-up Questions
    • ⤷ What is the hole-to-hole spacing required for mounting this heat sink?
    • ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied T766?
    • ⤷ How does 'Ducted' vs 'Unducted' flow affect the thermal resistance of this part?