ATS-01D-82-C2-R0
AI

The **ATS-01D-82-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components like integrated circuits (ICs), CPUs, or high-power transistors.
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### 1. Technical Specifications
The part number defines its physical and thermal characteristics. Below are the primary specifications:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 24.97°C/W (Unducted Flow @ 100 LFM) |
| **Dimensions** | 30mm x 30mm x 25mm |
| **Fin Style** | Straight Fin (High Density) |
| **Thermal Interface** | T766 (Phase change material/Grease) |
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### 2. Design and Engineering Details
#### A. pushPIN™ Attachment System
This component features a specialized mechanical attachment system. Instead of using messy adhesives or simple clips, it uses pre-assembled **spring-loaded push pins**.
* **Benefits:** Ensures consistent pressure (clamping force) for optimal heat transfer and prevents the heat sink from shifting during vibration.
* **Compatibility:** Designed for PCB holes with a specific diameter (usually 3.175mm).
#### B. Thermal Performance
The "Straight Fin" design is optimized for airflow. The performance varies significantly based on the air velocity (measured in Linear Feet per Minute - LFM):
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (Natural) | 24.97 |
| 300 | 9.09 |
| 500 | 6.22 |
#### C. Material & Coating
* **Aluminum:** Provides a lightweight solution with high thermal conductivity.
* **Blue Anodizing:** This is not just for aesthetics; the anodized layer increases the surface emissivity, which slightly improves radiative cooling and provides corrosion resistance.
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### 3. Application Use Cases
This heat sink is typically found in:
1. **Telecommunications:** Cooling FPGA and ASIC chips in routers or switches.
2. **Embedded Systems:** Industrial PCs where space is limited but vertical height (25mm) is available.
3. **Power Electronics:** Cooling MOSFETs or voltage regulators that generate localized heat.
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### 4. Part Number Breakdown
The nomenclature for **ATS-01D-82-C2-R0** can be decoded as follows:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **01:** Series designation.
* **D:** Attachment type (pushPIN™).
* **82:** Specific fin and base geometry.
* **C2:** Blue Anodized finish.
* **R0:** Revision/Packaging code.
- ⤷
What is the hole-to-hole spacing required for mounting this heat sink?
- ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied T766?
- ⤷ How does 'Ducted' vs 'Unducted' flow affect the thermal resistance of this part?