The **ATS-01D-80-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 🛠️ Technical Specifications | Feature | Specification | | :--- | :--- | | **Product Series** | blueICE™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 1.90° C/W @ 200 LFM | | **Dimensions (L x W x H)** | 30mm x 30mm x 25mm | | **Fin Style** | Straight Fin | --- ## 🔍 Key Electronic Components & Features ### 1. Thermal Interface Material (TIM) The "R0" suffix indicates the inclusion of a high-performance **T766 thermal phase-change material**. This is a critical electronic "part" that fills microscopic air gaps between the semiconductor die and the metal heat sink, drastically improving heat transfer efficiency. ### 2. Push-Pin Attachment Mechanism Instead of using messy adhesives or complicated screws, this model utilizes **dual plastic push-pins** with integrated springs. * **Purpose:** Ensures consistent downward pressure (clamping force) on the electronic chip. * **Safety:** Prevents the heat sink from shifting during mechanical shock or vibration, which could damage delicate surface-mount components. ### 3. Material Properties (Aluminum 6063) While not an "active" electronic part, the AL6063 alloy is selected for its high thermal conductivity and lightweight profile. The **Blue Anodized finish** is not just for aesthetics; it increases surface emissivity, aiding in heat dissipation through radiation and protecting the metal from environmental corrosion. --- ## 📈 Performance Data (Airflow) | Air Velocity (LFM) | Thermal Resistance (°C/W) | Pressure Drop (in-H2O) | | :--- | :--- | :--- | | 200 (1.0 m/s) | 1.90 | 0.16 | | 400 (2.0 m/s) | 1.34 | 0.35 | | 600 (3.0 m/s) | 1.10 | 0.53 | --- ## 📋 Typical Applications This component is commonly found in the following electronic systems: * **Networking Equipment:** High-speed routers and switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs and voltage regulators. * **Telecom:** Base station processing units.