The **ATS-01D-76-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for efficient cooling of integrated circuits (ICs) and other electronic packages. --- ### 1. General Specifications The following table highlights the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-01D-76-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) | | **Dimensions** | 25mm x 25mm x 15mm | | **Thermal Resistance** | 11.57°C/W (at 200 LFM) | --- ### 2. Key Features #### A. Fin Geometry * **Straight Fin Design:** This heat sink utilizes a vertical straight-fin pattern. This is ideal for systems with directed airflow (forced convection), as it minimizes resistance while maximizing the surface area available for heat dissipation. #### B. Attachment Mechanism (Push Pin) * The model uses a **brass push pin** with a stainless steel spring. * **Mechanical Security:** It provides a consistent, high-pressure contact between the heat sink and the electronic component (like a CPU or FPGA). * **Pre-Drilled Holes:** This requires the PCB to have specific mounting holes to lock the pins in place. #### C. Thermal Interface Material (TIM) * The suffix "R0" typically indicates that the part comes with **pre-applied Thermal Interface Material** (usually a phase-change material or high-performance thermal pad). * This ensures that the air gaps between the component and the heat sink are filled, drastically reducing thermal resistance. --- ### 3. Application Use Cases This specific heat sink is commonly used in environments where space is limited but heat output is moderate to high: 1. **Embedded Systems:** Cooling small-form-factor processors. 2. **Telecommunications:** Cooling ASICs and network switch chips. 3. **Power Electronics:** Managing heat for voltage regulators or power transistors. --- ### 4. Thermal Performance Comparison Thermal performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Unducted) | 27.33 | | 200 (Unducted) | 11.57 | | 400 (Unducted) | 6.96 | | 600 (Unducted) | 5.39 | ---