The **ATS-01D-72-C3-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for thermal management in electronic assemblies. --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-01D-72-C3-R0 | | **Component Type** | Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Fin Type** | Straight Fin | | **Thermal Resistance** | 5.10° C/W (Natural Convection) | | **Dimensions** | 45.00mm x 45.00mm x 15.00mm | --- ### Key Electronic & Mechanical Features #### 1. Thermal Management (C3 Classification) The "C3" in the part number refers to the thermal interface material (TIM) or the performance class. In this series, it typically indicates that the part comes pre-applied with **T766 Phase Change Material**, which optimizes the heat transfer between the semiconductor (CPU, FPGA, or GPU) and the aluminum heat sink. #### 2. Push-Pin Attachment Unlike adhesive-based heat sinks, the **R0** suffix indicates a push-pin mounting system with a brass or plastic pin and a compression spring. * **Benefits:** Provides consistent pressure on the electronic component, ensuring better thermal contact and reliability during mechanical vibration. * **Hole Pattern:** Designed for specific PCB layouts to ensure the sink is centered over the heat-generating chip. #### 3. Airflow Efficiency The **Straight Fin** design is optimized for environments with forced air (fans). The spacing between the fins allows for maximum surface area contact while minimizing pressure drop across the electronic assembly. #### 4. Blue Anodized Finish The blue anodization is not just for aesthetics; it provides: * Increased surface emissivity for better radiation cooling. * Corrosion resistance for long-term electronic durability. * Electrical insulation on the surface of the aluminum. --- ### Common Applications * **Semiconductor Cooling:** CPUs, Northbridge/Southbridge chips. * **Power Electronics:** High-power transistors or voltage regulators. * **Industrial Controls:** Telecommunications equipment and embedded systems where high-reliability cooling is required.