The **ATS-01D-71-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is a critical passive electronic component used for thermal management in dense electronic systems. --- ### 1. Technical Specifications Below are the key technical parameters for this specific part number: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Brass | | **Thermal Resistance** | 6.67°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Flow Orientation** | Straight Fin | --- ### 2. Physical Design Features The ATS-01D-71-C2-R0 is part of the **superGRIP™** or standard push-pin series, designed for secure attachment to a Printed Circuit Board (PCB). * **Straight Fin Design:** The fins are aligned in a single direction, making it ideal for systems with clear, directed airflow (longitudinal flow). * **Blue Anodized Coating:** This is not just aesthetic; the anodization increases the emissivity of the aluminum, slightly improving radiation heat transfer and protecting the metal from corrosion. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a phase-change material that fills the microscopic air gaps between the component (CPU/GPU) and the heat sink base. --- ### 3. Part Number Breakdown The nomenclature used by Advanced Thermal Solutions (ATS) provides specific details about the component: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **01D:** Reference to the specific series/attachment style. * **71:** Specific mechanical dimensions and fin configuration code. * **C2:** Refers to the color/finish (Blue Anodized). * **R0:** Revision code (Standard version). --- ### 4. Application Use Cases This heat sink is typically found in the following electronic environments: 1. **Telecommunications:** Cooling high-speed processors in routers and switches. 2. **Embedded Systems:** Industrial PCs where vertical clearance is approximately 30mm. 3. **Power Electronics:** Dissipating heat from MOSFETs or Power Management ICs (PMICs). ---