The **ATS-01D-65-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications Below are the primary mechanical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 25mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 7.29°C/W (Unducted Flow @ 100 LFM) | | **Fin Pattern** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Core Electronic/Physical Components #### A. The Heat Sink Body The body is constructed from **Aluminum 6063**, chosen for its excellent thermal conductivity and lightweight properties. The "Blue Anodized" coating is not just aesthetic; it provides surface protection against corrosion and increases the emissivity of the surface, slightly improving radiant heat transfer. #### B. The pushPIN™ Attachment System This part uses a proprietary attachment mechanism consisting of: * **Compression Springs:** These ensure a consistent, pre-determined pressure is applied to the electronic component (die/chip). * **Plastic/Brass Push Pins:** These snap into holes on the Printed Circuit Board (PCB), ensuring the heat sink remains secure during vibration or shipping. #### C. Thermal Interface Material (TIM) The base comes pre-applied with **T766**. In electronics, a TIM is crucial because it fills microscopic air gaps between the heat source (the chip) and the heat sink, significantly reducing contact thermal resistance. --- ### 3. Performance Summary The efficiency of this part is measured by its thermal resistance ($^\circ C/W$). Lower values indicate better cooling performance. | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (Ducted) | | :--- | :--- | :--- | | 100 | 0.5 | 7.29 °C/W | | 300 | 1.5 | 2.01 °C/W | | 500 | 2.5 | 1.39 °C/W | --- ### 4. Typical Applications * **ASIC/FPGA Cooling:** Used on high-speed integrated circuits. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high.