The **ATS-01D-62-C2-R0** is a high-performance thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Product Type** | pushPIN™ Heat Sink | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded bolts) | | **Thermal Resistance** | 16.48°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 40.00 mm x 40.00 mm | | **Height (Fin Depth)** | 15.00 mm | | **Fin Pitch** | COARSE-PITCH | | **Fin Pattern** | STRAIGHT | --- ### 2. Electronic Component Characteristics #### A. Thermal Interface Material (TIM) This specific model comes with **T766** pre-applied. The TIM is crucial because it fills microscopic air gaps between the heat sink base and the electronic component (die), significantly improving heat transfer efficiency. #### B. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, the "01D" designation indicates a mechanical attachment system. - **Spring-loaded bolts:** Provide consistent pressure across the component. - **Reliability:** Prevents the heat sink from shifting during mechanical shock or vibration, which is vital for mobile or industrial electronics. #### C. Airflow Performance The heat sink's efficiency is highly dependent on the velocity of air moving through the fins (measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (Ducted) | Thermal Resistance (Unducted) | | :--- | :--- | :--- | | 100 | 6.54 °C/W | 16.48 °C/W | | 300 | 3.34 °C/W | 4.91 °C/W | | 500 | 2.53 °C/W | 3.42 °C/W | --- ### 3. Typical Applications The ATS-01D-62-C2-R0 is commonly used in electronic assemblies where space is limited but heat dissipation is critical: * **Telecommunications:** High-speed routers and switches. * **Embedded Computing:** Industrial PC processors. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators (VRMs).