The **ATS-01D-57-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed by Advanced Thermal Solutions (ATS). It is part of the "Blue anodized" aluminum series, intended for cooling semiconductor packages. ### 1. Technical Specifications The following table summarizes the core electronic and physical attributes of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Thermal Resistance** | 13.16°C/W (at 100 LFM) to 1.70°C/W (at 700 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Design Elements #### A. pushPIN™ Attachment System Unlike adhesive-based heatsinks, the `ATS-01D-57-C2-R0` uses a mechanical **pushPIN™** system. This provides several benefits for PCB design: * **Constant Pressure:** Ensures optimal contact between the heatsink and the electronic component (CPU, GPU, or ASIC). * **Vibration Resistance:** Securely holds the part in place during shipping or high-vibration industrial environments. * **Easy Rework:** Allows for removal and re-installation without damaging the PCB or the component. #### B. Heat Sink Geometry (Fine Pitch) The "57" series features a **Straight Fin** design. * **Airflow Optimization:** Designed for forced-air cooling environments. * **Surface Area:** Maximize the surface area to dissipate heat from high-density electronic packages into the surrounding air. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. This is a crucial electronic layer that: * Fills microscopic air gaps between the semiconductor die and the aluminum base. * Minimizes thermal resistance at the contact point, preventing "hot spots" that can lead to silicon failure. --- ### 3. Electronic Performance Data The cooling efficiency depends on the Airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 13.16 | | 300 | 4.02 | | 500 | 2.56 | | 700 | 1.70 | --- ### 4. Typical Applications This component is commonly used to protect the following electronic parts: 1. **Microprocessors and FPGAs:** In networking equipment. 2. **Power Converters:** Managing heat in DC-DC power modules. 3. **LED Arrays:** High-brightness LED cooling to prevent lumen depreciation. ---