The **ATS-01D-55-C2-R0** is a specific high-performance electronic thermal management component. Below is a detailed breakdown of its technical specifications and physical properties. --- ## 1. Component Overview The **ATS-01D-55-C2-R0** is a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series, known for its high-efficiency aluminum construction and push-pin mounting system. ### Technical Specifications Table | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-01D-55-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 23.98°C/W (Natural) / 1.77°C/W (@200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Key Physical Dimensions The dimensions are critical for ensuring the part fits onto the PCB (Printed Circuit Board) without interfering with adjacent components. * **Length:** 35.00 mm * **Width:** 35.00 mm * **Height (Fin Height):** 10.00 mm * **Pitch (Hole-to-Hole):** 41.00 mm --- ## 3. Detailed Electronic & Thermal Properties ### Thermal Performance Heat sinks are rated by their ability to dissipate heat, measured in **°C/W** (Degrees Celsius per Watt). The lower the number, the better the cooling. * **Natural Convection:** 23.98°C/W (when no fan is used). * **Forced Air (200 LFM):** 1.77°C/W (significant performance boost with airflow). ### Mounting Mechanism (Push-Pin) This part uses a specific push-pin design: * **Spring Type:** Compression spring to provide uniform pressure across the component. * **Pin Material:** Brass for durability. * **Advantage:** Provides a secure, vibration-resistant connection to the PCB compared to adhesive tapes. ### Thermal Interface Material (T766) The "C2" in the part number indicates the specific TIM used. * **T766** is a phase-change or high-conductivity material that fills the microscopic air gaps between the heat sink and the electronic chip (CPU, GPU, or MOSFET). --- ## 4. Typical Applications This component is generally used for: 1. **BGA (Ball Grid Array) Cooling:** Used on chipsets, processors, and FPGAs. 2. **Power Supplies:** Cooling voltage regulators. 3. **Telecommunications:** Network switches and routers where space is limited but heat density is high. ---