The **ATS-01D-33-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of integrated circuits (ICs) and other PCB-mounted components. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this specific part: | Characteristic | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 20.00mm | | **Material** | Aluminum (AL6063) | | **Fin Style** | Square Cross-Cut (Blue Anodized) | | **Attachment Type** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 17.42°C/W (Unducted @ 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Design and Engineering Features ### A. Fin Geometry (Cross-Cut) The heat sink features a **cross-cut** design. This pattern creates a grid of square fins which allows for multi-directional airflow. This is particularly useful in electronic enclosures where the direction of the cooling fan's exhaust might not be perfectly aligned with the heat sink. ### B. Push-Pin Attachment Mechanism Instead of using messy thermal adhesives or complex screws, the `ATS-01D-33-C2-R0` utilizes a **push-pin and brass spring** system: * **Ease of Assembly:** It can be installed manually or with simple tools. * **Constant Pressure:** The spring ensures consistent contact pressure between the heat sink and the component (CPU/GPU/FPGA), which is critical for heat transfer. * **Reliability:** It prevents the heat sink from shifting during mechanical shock or vibration. ### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. T766 is a high-performance thermal grease/pad that fills the microscopic air gaps between the component surface and the aluminum base, significantly reducing thermal impedance. --- ### 3. Application Use Cases This specific heat sink size (35mm) and height (20mm) is commonly used for: 1. **Network Switches/Routers:** Cooling high-speed processors. 2. **Industrial PCs:** Maintaining stability in fanless or low-airflow environments. 3. **Power Electronics:** Managing heat in DC-DC converters or motor drivers. ---