The **ATS-01D-32-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits (ICs). --- ### 1. Technical Specifications The part number itself contains specific technical details regarding its dimensions and thermal properties. | Specification | Detail | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W)** | 54.00mm x 54.00mm | | **Height** | 12.70mm | | **Fin Style** | Straight Fin | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Thermal Performance Data Thermal resistance is measured in °C/W (Degrees Celsius per Watt). A lower number indicates better heat dissipation. * **Unducted Flow (@200 LFM):** ~5.00 °C/W * **Ducted Flow:** Significantly lower, as airflow is forced through the fins. --- ### 3. Key Component Breakdown #### A. The Heat Sink Body The body is made of extruded aluminum. Aluminum is chosen for its excellent thermal conductivity and lightweight properties. The **blue anodized finish** is not just for aesthetics; it provides corrosion resistance and increases surface emissivity, which slightly improves radiative cooling. #### B. Attachment Mechanism (Push-Pins & Springs) The **C2** in the part number refers to the specific attachment hardware: * **Brass Push-Pins:** Used to secure the heat sink to pre-drilled holes in the PCB. * **Compression Springs:** These provide constant pressure to ensure a tight, flush fit between the heat sink base and the electronic component, which is critical for heat transfer. #### C. Thermal Interface Material (TIM) The base comes pre-applied with **T766 phase-change material**. This eliminates the need for manual thermal paste application. When the component heats up, the TIM softens to fill microscopic air gaps between the chip and the heat sink. --- ### 4. Typical Applications * **Embedded Systems:** Cooling processors in industrial computers. * **Telecommunications:** High-speed routers and switches. * **Power Electronics:** Dissipating heat from MOSFETs or power regulators.