The **ATS-01D-30-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ HS Assembly | | **Material** | Aluminum (Blue Anodized) | | **Dimension (Length x Width)** | 40mm x 40mm | | **Height** | 25mm | | **Fin Style** | Straight Fin | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 5.31°C/W (at 100 LFM) | --- ### 2. Key Electronic Features #### A. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of Thermal Interface Material pre-applied to the base. - It uses **T766**, a high-performance thermal grease. - This ensures maximum heat transfer between the electronic component (heat source) and the aluminum sink by filling microscopic air gaps. #### B. Attachment Mechanism (pushPIN™) Unlike adhesive-based heat sinks, this model uses a mechanical **pushPIN** system: - **Stability:** It provides a specific pressure (clamping force) required for optimal thermal contact. - **Reliability:** It is more resistant to vibration and thermal expansion than simple peel-and-stick tapes. - **Hardware:** It typically uses brass or plastic pins with a stainless steel spring. #### C. Airflow Optimization The straight-fin design is optimized for **forced air cooling** (active cooling via a fan). The spacing between the fins is engineered to minimize "pressure drop" while maximizing the surface area exposed to moving air. --- ### 3. Usage Context In an electronic circuit, this part is used as a **passive cooling element** that becomes part of the thermal circuit. It is commonly found on: 1. **Voltage Regulators:** Managing heat in high-current DC-DC converters. 2. **FPGA/ASIC:** Cooling custom integrated circuits in networking gear. 3. **Industrial Controls:** Protecting power components in harsh environments. ---