The **ATS-01D-25-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-01D-25-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Fin Type** | Fine Pitch (Straight Fin) | | **Dimensions** | 60mm x 60mm x 20mm | | **Thermal Resistance** | ~6.26 °C/W (Unducted @ 200 LFM) | --- ### 2. Key Electronic Functions While the heatsink itself does not contain circuitry, its role in an electronic system is critical for the following reasons: #### A. Thermal Dissipation The primary function is to increase the surface area of the heat-generating component. The **Blue Anodized** finish is not just aesthetic; it increases thermal emissivity, allowing the part to radiate heat more efficiently than raw aluminum. #### B. Push-Pin Mounting Mechanism The "C2" designation usually refers to the specific attachment kit. This model uses a **Plastic Push-Pin** system with a compression spring. * **Purpose:** Ensures consistent pressure (clamping force) between the heatsink and the electronic chip. * **Reliability:** Prevents the heatsink from shifting during mechanical shock or vibration. #### C. Thermal Interface Material (TIM) Typically, these units come pre-applied with a **Phase Change Material** or high-performance thermal pad. This fills the microscopic air gaps between the chip surface and the heatsink base, significantly lowering the junction temperature. --- ### 3. Application Use Cases This specific size (60mm) and height (20mm) make it suitable for: * **Embedded Systems:** Industrial PCs where vertical space is limited. * **Power Electronics:** Large MOSFET arrays or high-current voltage regulators. * **Networking Gear:** Cooling ASICs in switches and routers. --- ### 4. Part Number Breakdown * **ATS:** Advanced Thermal Solutions (Manufacturer). * **01D:** Series identifier. * **25:** Specific fin geometry/density code. * **C2:** Attachment hardware (Push-pins and Springs). * **R0:** RoHS Compliance (Lead-free).