## Overview of ATS-01D-191-C2-R0 The **ATS-01D-191-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). While it is a mechanical component, it is a critical part of electronic system design, specifically categorized under **Thermal Management**. --- ### 1. Technical Specifications The following table highlights the physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm | | **Height (Off Base)** | 30mm | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 2.90°C/W (at 100 LFM) | --- ### 2. Key Electronic Components & Design Though it contains no circuitry, its design is engineered to interface with electronic semiconductors: * **Thermal Interface Material (TIM):** The "R0" suffix typically indicates that the unit comes pre-applied with **T766**, a high-performance phase-change thermal interface material that fills microscopic air gaps between the heat sink and the CPU/GPU. * **Attachment Mechanism:** It uses a **Push-Pin** system with a compression spring. This ensures consistent pressure across the electronic chip, which is vital for preventing hotspots and mechanical stress on the PCB. * **Fin Configuration:** It features a **Fine Pitch** straight fin design. This is optimized for systems with high-velocity airflow (Active Cooling), allowing heat to be stripped away from the electronic package efficiently. --- ### 3. Application Use Cases This part is commonly found in the following electronic environments: 1. **Telecommunications:** Cooling high-speed signal processors. 2. **Embedded Systems:** Dissipating heat from FPGAs or ARM-based SoCs. 3. **Power Electronics:** Managing thermal loads in DC-DC converters. --- ### 4. Thermal Performance Data Performance varies based on the airflow (Measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 2.90 | | 300 (1.5 m/s) | 1.56 | | 500 (2.5 m/s) | 1.25 |