The **ATS-01D-19-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heat Sink**. It is designed to dissipate heat from integrated circuits (ICs) and other electronic components to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of the ATS-01D-19-C2-R0: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-01D-19-C2-R0 | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 9.77°C/W (at 100 LFM) | | **Dimensions (L x W)** | 54mm x 54mm | | **Height (H)** | 20mm | | **Weight** | ~60 grams | --- ## 2. Key Design Elements ### A. Fin Geometry (Straight Fin) The "D" in the part number indicates a specific fin pattern. This model typically features a **Straight Fin** design, which provides a large surface area for heat exchange. This is ideal for systems with consistent, unidirectional airflow. ### B. pushPIN™ Attachment System One of the most critical "electronic parts" of this assembly is the mounting hardware. - **The Mechanism:** It uses a spring-loaded pin (pushPIN™) that engages with pre-drilled holes in the PCB. - **Reliability:** The springs provide precise, uniform pressure (clamping force) across the component, ensuring maximum contact with the thermal interface material (TIM). ### C. Material and Coating - **Aluminum (6063):** Chosen for its excellent thermal conductivity-to-weight ratio. - **Blue Anodized Finish:** This is not just for aesthetics; the anodized layer provides increased corrosion resistance and slightly improves emissivity, which helps with radiant heat transfer. --- ## 3. Thermal Performance Profile The effectiveness of this part depends on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 9.77 | | 200 | 1.0 | 3.32 | | 400 | 2.0 | 1.82 | | 600 | 3.0 | 1.34 | --- ## 4. Typical Applications * **Processors (CPUs/GPUs):** For low-to-mid TDP chips. * **FPGAs & ASICs:** Used in telecommunications and data centers. * **Power Supplies:** Cooling MOSFETs or power regulators that generate significant heat.