The **ATS-01D-18-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. These parts are designed to dissipate heat from integrated circuits (ICs), such as CPUs, GPUs, or FPGAs, ensuring they remain within safe operating temperatures. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Property | Specification | | :--- | :--- | | **Product Type** | Heatsink (Push-Pin Mount) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35mm x 35mm x 15mm | | **Fin Type** | Fine Pitch (Straight Fin) | | **Attachment Method** | Plastic Push-Pin with Brass Spring | | **Thermal Resistance** | Approx. 13.38°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Components & Electronics Role #### A. The Heatsink Body (Heat Dissipation) The core function of this part is to increase the surface area of a semiconductor device. By using a **fine-pitch fin design**, the ATS-01D-18-C2-R0 maximizes the contact area with the surrounding air, allowing for efficient heat transfer via convection. #### B. The Push-Pin & Spring Mechanism Unlike adhesive-based heatsinks, this part uses a mechanical fastening system: - **Push-Pins:** Plastic components that lock into pre-drilled holes on the PCB. - **Springs:** Provide constant, uniform pressure (load) on the electronic component. This ensures the best possible contact with the silicon die or heat spreader. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates a specific type of pre-applied thermal pad or grease (**T766**). This material fills microscopic air gaps between the electronics and the aluminum, significantly reducing thermal resistance. --- ### 3. Application Use Cases This specific heatsink is commonly found in the following electronic environments: * **Networking Gear:** Routers, switches, and modems. * **Embedded Systems:** Industrial PC boards where vibration might shake loose adhesive heatsinks. * **Power Supplies:** Cooling voltage regulators or power MOSFETs. --- ### 4. Thermal Performance Comparison The effectiveness of this part depends on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **Unducted (Natural)** | 13.38 | | **200 LFM (Forced)** | 4.95 | | **400 LFM (High Speed)** | 3.10 | ---