The **ATS-01D-17-C2-R0** is a high-performance electronic component specifically categorized as a **Heat Sink**. It is manufactured by *Advanced Thermal Solutions (ATS)* as part of their "blueICE" push-pin series. Below is a detailed breakdown of its specifications and physical characteristics. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Number** | ATS-01D-17-C2-R0 | | **Type** | Top Mount / Push-Pin Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 15.44°C/W (Unducted Flow @ 100 LFM) | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout and ensuring clearance from other surface-mount devices (SMDs). * **Length:** 35.00 mm * **Width:** 35.00 mm * **Height (Fin Depth):** 12.70 mm * **Fin Style:** Straight Fin (optimized for airflow) --- ### 3. Core Components & Functionality #### A. The Heat Sink Body The body is made of **Aluminum 6063**, chosen for its excellent thermal conductivity and lightweight properties. The "Straight Fin" design allows air to pass through easily, which is ideal for systems with directed fan cooling. #### B. Attachment Mechanism (Push-Pins) Unlike adhesive-based heat sinks, this model uses a **Push-Pin** system with a compression spring. * **Benefits:** Provides consistent downward pressure for better thermal contact. * **Reliability:** It is more secure than thermal tape in high-vibration environments. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766 phase-change material**. This eliminates the need for manual application of thermal paste. When the device heats up, the T766 softens to fill microscopic air gaps between the component and the heat sink. #### D. Anodized Coating The **Blue Anodized** finish is not just aesthetic; it provides: * Increased corrosion resistance. * Electrical insulation (preventing short circuits if it touches nearby leads). * Slightly improved emissivity for radiant cooling. --- ### 4. Application Use Cases This specific heat sink is typically used for cooling: * **ASICs and FPGAs:** High-speed processing units that generate localized heat. * **Power Modules:** DC-DC converters or motor drivers. * **Networking Equipment:** Routers and switches where vertical space (12.7mm) is available.