ATS-01D-161-C2-R0
AI

The **ATS-01D-161-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). While it is not an active electronic component (like a chip), it is a critical thermal management part designed to protect electronic components from overheating.
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### 1. Technical Specifications
The part belongs to the **pushPIN™** series, designed for easy mounting and high thermal efficiency.
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm |
| **Attachment Type** | Push-Pin (Brass) |
| **Spring Type** | ATS-PPS-01 |
| **Fin Style** | Straight Fin |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Thermal Performance Data
Performance varies based on the velocity of the airflow (LFM - Linear Feet per Minute).
| Air Velocity (LFM) | Thermal Resistance (°C/W - Unducted) | Thermal Resistance (°C/W - Ducted) |
| :--- | :--- | :--- |
| 100 (0.5 m/s) | 4.74 | 2.57 |
| 200 (1.0 m/s) | 2.57 | 1.93 |
| 400 (2.0 m/s) | 1.83 | 1.58 |
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### 3. Key Electronic/Mechanical Features
* **Heat Sink Material:** Extruded aluminum (6063) provides a lightweight solution with high thermal conductivity.
* **Push-Pin Attachment:** This uses a spring-loaded mechanism that provides consistent pressure across the interface, ensuring maximum heat transfer.
* **Straight Fin Design:** Optimized for environments with directed airflow. The gaps between the fins allow air to strip heat away from the aluminum surface effectively.
* **Pre-applied TIM:** It comes with **T766** thermal interface material. This eliminates the need for applying thermal paste manually, ensuring a uniform layer between the component and the heat sink.
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### 4. Typical Applications
This specific size and thermal profile are commonly used for:
* **Processors (CPUs/GPUs):** Small form factor processing units.
* **FPGAs & ASICs:** High-speed logic chips that generate significant localized heat.
* **Power Supplies:** Cooling voltage regulators or power transistors.
* **Networking Gear:** Cooling chips inside routers and switches.
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What are the benefits of using a push-pin attachment over adhesive tape for heat sinks?
- ⤷ How does 'ducted' vs 'unducted' airflow impact the cooling efficiency of this part?
- ⤷ Can the T766 thermal interface material be replaced with a different compound if needed?