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  • ATS-01D-161-C2-R0

  • AI
    The **ATS-01D-161-C2-R0** is a high-performance **heat sink** manufactured by Advanced Thermal Solutions (ATS). While it is not an active electronic component (like a chip), it is a critical thermal management part designed to protect electronic components from overheating. --- ### 1. Technical Specifications The part belongs to the **pushPIN™** series, designed for easy mounting and high thermal efficiency. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm | | **Attachment Type** | Push-Pin (Brass) | | **Spring Type** | ATS-PPS-01 | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Thermal Performance Data Performance varies based on the velocity of the airflow (LFM - Linear Feet per Minute). | Air Velocity (LFM) | Thermal Resistance (°C/W - Unducted) | Thermal Resistance (°C/W - Ducted) | | :--- | :--- | :--- | | 100 (0.5 m/s) | 4.74 | 2.57 | | 200 (1.0 m/s) | 2.57 | 1.93 | | 400 (2.0 m/s) | 1.83 | 1.58 | --- ### 3. Key Electronic/Mechanical Features * **Heat Sink Material:** Extruded aluminum (6063) provides a lightweight solution with high thermal conductivity. * **Push-Pin Attachment:** This uses a spring-loaded mechanism that provides consistent pressure across the interface, ensuring maximum heat transfer. * **Straight Fin Design:** Optimized for environments with directed airflow. The gaps between the fins allow air to strip heat away from the aluminum surface effectively. * **Pre-applied TIM:** It comes with **T766** thermal interface material. This eliminates the need for applying thermal paste manually, ensuring a uniform layer between the component and the heat sink. --- ### 4. Typical Applications This specific size and thermal profile are commonly used for: * **Processors (CPUs/GPUs):** Small form factor processing units. * **FPGAs & ASICs:** High-speed logic chips that generate significant localized heat. * **Power Supplies:** Cooling voltage regulators or power transistors. * **Networking Gear:** Cooling chips inside routers and switches.
    ✨ Follow-up Questions
    • ⤷ What are the benefits of using a push-pin attachment over adhesive tape for heat sinks?
    • ⤷ How does 'ducted' vs 'unducted' airflow impact the cooling efficiency of this part?
    • ⤷ Can the T766 thermal interface material be replaced with a different compound if needed?