The **ATS-01D-152-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "Blue Anodized" series designed specifically for cooling electronic components like CPUs, GPUs, and power modules. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (with springs) | | **Thermal Resistance** | 3.32°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 35mm x 35mm x 25mm | | **Fin Pattern** | Straight Fin | | **Heat Sink Type** | Passive (can be used with active airflow) | --- ### 2. Key Components & Design Features #### A. The Fin Geometry The "152" series utilizes a **straight-fin** design. This is optimized for single-directional airflow. The spacing between the fins is engineered to balance the surface area for heat dissipation against the pressure drop caused by the air passing through. #### B. The Push-Pin Attachment The `-R0` suffix indicates the mounting hardware. It uses a **plastic push-pin and brass spring** mechanism: * **Compression Spring:** Provides consistent pressure (force) on the component to ensure optimal thermal interface contact. * **Drilled Holes:** Requires specific hole diameters (typically 3mm) on the PCB for installation. #### C. Thermal Interface Material (TIM) Usually, these units come with a pre-applied **Phase Change Material (PCM)** or high-performance thermal tape on the base. This fills the microscopic air gaps between the heat sink and the electronic chip. --- ### 3. Electronic Application Usage This heat sink is commonly found in the following electronic environments: 1. **Telecommunications:** Cooling ASICs and FPGAs in networking switches. 2. **Power Electronics:** Dissipating heat from MOSFETs or IGBT modules. 3. **Embedded Systems:** Used on industrial PC motherboards where vertical space (25mm height) allows for better convection than low-profile sinks. --- ### 4. Thermal Performance Data *Measured in °C/W (Degrees Celsius per Watt):* | Airflow (LFM) | Velocity (m/s) | Thermal Resistance | | :--- | :--- | :--- | | 200 | 1.0 | 3.32 °C/W | | 400 | 2.0 | 2.11 °C/W | | 600 | 3.0 | 1.75 °C/W |