The **ATS-01D-150-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "blue ICE" series, designed for cooling electronic components such as processors, chipsets, or power modules. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Dimensions** | 35.00mm x 35.00mm | | **Height (Fin Height)** | 25.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 4.82°C/W (at 200 LFM) | | **Flow Pattern** | Straight Fin | --- ### 2. Key Electronic & Mechanical Parts The assembly is not just a block of metal; it consists of several critical elements that work together to manage heat: #### A. The Heat Sink Body (Aluminum) * **Purpose:** Provides a high surface area for heat dissipation. * **Design:** Features vertical fins that allow air from fans or natural convection to pass through and carry heat away from the source. #### B. The pushPIN™ Attachment System * **Mechanism:** Instead of using adhesive tape, this model uses a mechanical spring-loaded pin. * **Components:** * **Plastic/Brass Pins:** Inserted into pre-drilled holes on the PCB. * **Compression Springs:** Provide constant pressure, ensuring a tight mechanical bond between the chip and the heat sink. #### C. Thermal Interface Material (TIM) * **Type:** Pre-applied **T766** phase-change material or thermal grease. * **Function:** Fills microscopic air gaps between the heat sink base and the electronic component (CPU/GPU), significantly improving thermal conductivity. --- ### 3. Application Use Cases This specific part is typically found in the following electronic environments: 1. **Telecommunications:** Cooling networking chips in routers and switches. 2. **Embedded Systems:** High-heat microcontrollers or SoCs (System on Chips). 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.