The part number **ATS-01D-147-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "blue ICE" series, designed specifically for cooling electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The following table highlights the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm | | **Thermal Resistance (Flowing)** | 13.52 °C/W (@ 100 LFM) | | **Thermal Resistance (Static)** | 26.65 °C/W (@ 0 LFM) | | **Fin Style** | Straight Fin | --- ### 2. Design Characteristics This electronic cooling component is engineered with several specific features to ensure durability and efficiency: * **pushPIN™ Attachment:** This is a specialized fastening system that allows for quick and secure mounting to a PCB (Printed Circuit Board). It usually involves a spring-loaded pin that provides precise pressure on the component to ensure optimal thermal contact. * **Straight Fin Profile:** The "Straight Fin" design is optimized for environments with consistent airflow (forced convection). It allows air to pass through the channels with minimal resistance. * **C2 Material Grade:** The "C2" suffix typically denotes the thermal interface material (TIM) or the specific aluminum alloy/coating used. In this case, it indicates the use of a high-quality thermal pad or grease pre-applied to the base. * **Blue Anodized Coating:** The blue finish is not just for aesthetics; anodizing increases the surface emissivity and protects the aluminum from environmental corrosion. --- ### 3. Application Use-Cases The **ATS-01D-147-C2-R0** is commonly found in the following electronic sectors: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Embedded Systems:** Heat management for industrial controllers where space is limited (10mm height). 3. **Power Electronics:** Managing heat dissipation for MOSFETs or power regulators. ---