ATS-01D-101-C3-R0
AI

The **ATS-01D-101-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific part number:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 24.00mm x 24.00mm x 28.00mm |
| **Fin Style** | Straight (Vertical) |
| **Thermal Resistance** | 6.77°C/W (at 100 LFM) |
| **Compliance** | RoHS and REACH Compliant |
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### 2. Electronic Component Breakdown
#### A. Thermal Resistance
The core "electronic" function of this part is to lower the thermal resistance between the semiconductor junction and the ambient air. With a value of **6.77°C/W** at low airflow, it is highly efficient for small-form-factor components that generate significant heat.
#### B. pushPIN™ Attachment System
This part utilizes a specialized mechanical attachment system designed for high-reliability PCBs:
* **Compression Springs:** Ensures even pressure across the thermal interface material (TIM).
* **Brass Bolts:** Provides a secure connection that resists vibration and mechanical shock better than adhesive tapes.
#### C. Material Science (Blue Anodized)
The blue anodization is not just for aesthetics; it provides:
* **Electrical Insulation:** Prevents short circuits if the sink accidentally touches nearby components.
* **Emissivity:** Improves the radiant heat transfer properties compared to raw aluminum.
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### 3. Application Use Cases
This specific heat sink is typically found in the following electronic environments:
1. **Telecommunications:** Cooling signal processors in networking switches.
2. **Embedded Systems:** Industrial PCs where space is limited but vertical height (28mm) is available.
3. **Power Electronics:** Dissipating heat from high-speed voltage regulators.
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- ⤷What is the difference between pushPIN and adhesive mounting for heat sinks?
- ⤷ How does airflow speed (LFM) affect the thermal resistance of the ATS-01D-101-C3-R0?
- ⤷ What type of Thermal Interface Material (TIM) is recommended for this specific model?