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  • ATS-01D-101-C3-R0

  • AI
    The **ATS-01D-101-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 24.00mm x 24.00mm x 28.00mm | | **Fin Style** | Straight (Vertical) | | **Thermal Resistance** | 6.77°C/W (at 100 LFM) | | **Compliance** | RoHS and REACH Compliant | --- ### 2. Electronic Component Breakdown #### A. Thermal Resistance The core "electronic" function of this part is to lower the thermal resistance between the semiconductor junction and the ambient air. With a value of **6.77°C/W** at low airflow, it is highly efficient for small-form-factor components that generate significant heat. #### B. pushPIN™ Attachment System This part utilizes a specialized mechanical attachment system designed for high-reliability PCBs: * **Compression Springs:** Ensures even pressure across the thermal interface material (TIM). * **Brass Bolts:** Provides a secure connection that resists vibration and mechanical shock better than adhesive tapes. #### C. Material Science (Blue Anodized) The blue anodization is not just for aesthetics; it provides: * **Electrical Insulation:** Prevents short circuits if the sink accidentally touches nearby components. * **Emissivity:** Improves the radiant heat transfer properties compared to raw aluminum. --- ### 3. Application Use Cases This specific heat sink is typically found in the following electronic environments: 1. **Telecommunications:** Cooling signal processors in networking switches. 2. **Embedded Systems:** Industrial PCs where space is limited but vertical height (28mm) is available. 3. **Power Electronics:** Dissipating heat from high-speed voltage regulators. ---
    ✨ Follow-up Questions
    • ⤷What is the difference between pushPIN and adhesive mounting for heat sinks?
    • ⤷ How does airflow speed (LFM) affect the thermal resistance of the ATS-01D-101-C3-R0?
    • ⤷ What type of Thermal Interface Material (TIM) is recommended for this specific model?