The **ATS-01B-98-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). This component is designed for thermal management in electronic systems, specifically for cooling integrated circuits (ICs) and other heat-generating surface-mount devices. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Thermal Resistance** | 15.31°C/W (at 200 LFM) | | **Attachment Method** | pushPIN™ | | **Flow Orientation** | Cross-Flow (Square Fin Layout) | | **Fin Type** | Straight Fin | --- ### 2. Electronic Application & Function While the heat sink itself does not have circuitry, it is a critical "passive" electronic part used to maintain the reliability of active components: * **Thermal Dissipation:** It increases the surface area of a component (like a BGA processor or FPGA), allowing heat to be transferred more efficiently to the surrounding air. * **Protection:** Prevents "thermal throttling" or hardware failure due to overheating. * **The pushPIN™ System:** This specific model uses the ATS pushPIN™ mechanism, which includes a precise compression spring. This ensures even pressure across the electronic chip, preventing mechanical damage to the solder balls or the die. --- ### 3. Part Number Breakdown (Nomenclature) The part number can be decoded to understand its specific configuration: 1. **ATS**: Manufacturer (Advanced Thermal Solutions). 2. **01**: Series type (Standard heat sink). 3. **B**: Material / Configuration code. 4. **98**: Specific dimensions/design iteration. 5. **C2**: Thermal interface material (TIM) or specific coating (usually implies a high-performance Blue Anodized finish). 6. **R0**: RoHS compliance status. --- ### 4. Implementation Example If you were integrating this into a PCB design using a CAD tool (like Altium or Eagle), you would need to account for the mounting holes required by the pushPIN™ system: ```text // Mechanical layout requirements Drill_Hole_Diameter: 3.175mm (Typical for pushPIN) Pitch_Distance: 38mm (Center-to-Center) Required_Airflow: >200 LFM (Recommended for optimal cooling) ```