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  • ATS-01B-97-C2-R0

  • AI
    The **ATS-01B-97-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed for cooling electronic components like CPUs, GPUs, or FPGAs. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimensions** | 45mm x 45mm x 10mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 20.30 °C/W (at 100 LFM) to 3.20 °C/W (at 600 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Electronic Functions While the heat sink itself does not carry current, it is a critical "passive" electronic part that ensures the reliability of active circuits: * **Heat Dissipation:** It increases the surface area of a semiconductor package, allowing heat to transfer from the silicon die to the ambient air more efficiently. * **Thermal Protection:** By maintaining the Junction Temperature ($T_j$) within safe limits, it prevents **Thermal Throttling** (where a processor slows down to cool off) and permanent hardware failure. * **Attachment Mechanics:** The "Push-Pin" mechanism provides a consistent spring-loaded force against the PCB. This ensures the Thermal Interface Material (TIM) is compressed correctly for maximum heat transfer without cracking the delicate silicon die. --- ### 3. Application Use Cases This specific model is typically used in the following electronic environments: 1. **Telecommunications:** High-speed routers and switches. 2. **Industrial PC (IPC):** Embedded controllers that run in high-temperature environments. 3. **Power Supplies:** Cooling MOSFETs or voltage regulators. --- ### 4. Thermal Performance Data Performance varies based on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: | Airflow Velocity | Thermal Resistance (°C/W) | | :--- | :--- | | **100 LFM** | 20.30 | | **300 LFM** | 6.10 | | **600 LFM** | 3.20 | ---
    ✨ Follow-up Questions
    • ⤷What is the difference between the T766 and other thermal interface materials?
    • ⤷ How do I calculate the correct hole diameter for the push-pin installation?
    • ⤷ Are there copper versions of this heat sink for higher thermal conductivity?