ATS-01B-97-C2-R0
AI

The **ATS-01B-97-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed for cooling electronic components like CPUs, GPUs, or FPGAs.
### 1. Technical Specifications
Below are the primary physical and thermal characteristics of this part:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | Push-Pin (Plastic/Brass) |
| **Dimensions** | 45mm x 45mm x 10mm |
| **Fin Style** | Straight Fin |
| **Thermal Resistance** | 20.30 °C/W (at 100 LFM) to 3.20 °C/W (at 600 LFM) |
| **Thermal Interface Material** | T766 (Pre-applied) |
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### 2. Key Electronic Functions
While the heat sink itself does not carry current, it is a critical "passive" electronic part that ensures the reliability of active circuits:
* **Heat Dissipation:** It increases the surface area of a semiconductor package, allowing heat to transfer from the silicon die to the ambient air more efficiently.
* **Thermal Protection:** By maintaining the Junction Temperature ($T_j$) within safe limits, it prevents **Thermal Throttling** (where a processor slows down to cool off) and permanent hardware failure.
* **Attachment Mechanics:** The "Push-Pin" mechanism provides a consistent spring-loaded force against the PCB. This ensures the Thermal Interface Material (TIM) is compressed correctly for maximum heat transfer without cracking the delicate silicon die.
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### 3. Application Use Cases
This specific model is typically used in the following electronic environments:
1. **Telecommunications:** High-speed routers and switches.
2. **Industrial PC (IPC):** Embedded controllers that run in high-temperature environments.
3. **Power Supplies:** Cooling MOSFETs or voltage regulators.
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### 4. Thermal Performance Data
Performance varies based on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure:
| Airflow Velocity | Thermal Resistance (°C/W) |
| :--- | :--- |
| **100 LFM** | 20.30 |
| **300 LFM** | 6.10 |
| **600 LFM** | 3.20 |
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- ⤷What is the difference between the T766 and other thermal interface materials?
- ⤷ How do I calculate the correct hole diameter for the push-pin installation?
- ⤷ Are there copper versions of this heat sink for higher thermal conductivity?