The **ATS-01B-95-C2-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **blueICE™** series and is categorized as a high-performance **Heat Sink**, designed specifically for cooling integrated circuits (ICs) and surface-mount devices. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Family** | pushPIN™ Heat Sink Assembly | | **Material** | Aluminum (AL6063) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance (Flow)** | 7.29 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 1.75 °C/W @ 700 LFM | | **Fin Style** | Straight Fin | | **Finish** | Blue Anodized | --- ### 2. Physical Dimensions Precision in dimensions is critical for PCB layout and clearance from adjacent electronic components. * **Length (A):** 40.00 mm * **Width (B):** 40.00 mm * **Height (C):** 20.00 mm * **Pitch (E):** 33.00 mm (Distance between mounting holes) * **Pitch (F):** 33.00 mm --- ### 3. Key Electronic Cooling Features #### A. Attachment Mechanism The **pushPIN™** system uses a flexible, spring-loaded mechanism. This ensures: 1. **Uniform Pressure:** Prevents damage to delicate silicon dies by distributing force evenly. 2. **Vibration Resistance:** Securely holds the heat sink in place during industrial vibration or shipping. 3. **Ease of Assembly:** Features pre-drilled holes for rapid installation. #### B. Thermal Interface Material (TIM) This specific model typically comes with **T412** thermal interface material pre-applied to the base. This fills microscopic air gaps between the chip and the heat sink to maximize heat transfer efficiency. #### C. Fin Design The **Straight Fin** geometry is optimized for "Longitudinal" airflow. This means it performs best when fans are blowing air directly through the channels created by the fins. --- ### 4. Typical Applications * **Processors (CPUs/GPUs):** Cooling small form-factor embedded processors. * **FPGAs:** Managing heat in high-speed logic devices. * **Power Electronics:** Dissipating heat from MOSFETs or power regulators in telecommunication equipment.