The **ATS-01B-93-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of this component: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 40mm x 40mm x 20mm | | **Fin Style** | Straight (Extruded) | | **Attachment Method** | Push Pin (Brass) with Compression Spring | | **Thermal Resistance** | 7.37 °C/W (at 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Electronic & Mechanical Features #### A. Thermal Management Performance The primary role of this part is to dissipate heat from integrated circuits (ICs). Its thermal performance is measured by its resistance to heat flow. * **Low Airflow:** At low air velocities (200 LFM), it provides a resistance of **7.37 °C/W**. * **High Airflow:** At higher velocities (600 LFM), efficiency increases, dropping resistance to approximately **3.17 °C/W**. #### B. Push Pin Mounting System Unlike adhesive-based heat sinks, the **01B-93-C2-R0** uses a mechanical push pin system. * **Spring-Loaded:** The brass push pins use a compression spring to ensure even pressure across the chip surface. * **Reliability:** This prevents the heat sink from shifting during vibration or mechanical shock, making it suitable for industrial or automotive electronics. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766**, a high-performance phase-change material. This ensures: * Minimal air gaps between the component and the heat sink. * Ease of assembly during mass production (no manual paste application required). --- ### 3. Applications This specific heat sink is typically used in the following electronic environments: 1. **Networking Hardware:** Switches and routers requiring 24/7 cooling. 2. **Embedded Systems:** Industrial PCs where mechanical stability is critical. 3. **Power Supplies:** Cooling voltage regulators or MOSFETs. ---