The **ATS-01B-83-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ HS | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 20.00mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 16.03°C/W (at 100 LFM) | | **Fin Style** | Straight | | **Fin Pattern** | Fine Pitch | --- ## 2. Key Design Features ### A. pushPIN™ Attachment Mechanism Unlike adhesive-based heat sinks, the ATS-01B-83-C2-R0 uses a **push-pin and spring assembly**. This provides several advantages: * **Constant Pressure:** The spring ensures consistent contact between the heat sink base and the component. * **Reliability:** It is more vibration-resistant than thermal tape. * **Serviceability:** It can be removed and reinstalled easily during maintenance. ### B. Thermal Interface Material (TIM) This specific model usually comes pre-applied with **ATS-PPS-01**, which is a high-performance phase-change thermal interface material. This ensures minimal air gaps between the heat source and the aluminum base. ### C. Aerodynamics The straight-fin design is optimized for **forced air cooling** (active cooling via fans). The fine-pitch spacing maximizes surface area while maintaining a profile that doesn't overly restrict airflow within a tight chassis. --- ## 3. Applications This part is typically found in: * **Telecommunications:** Networking switches and routers. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Voltage regulators and high-speed memory modules.