The **ATS-01B-66-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed to cool electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part number: | Property | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-01B-66-C2-R0 | | **Heatsink Type** | Push-Pin (Blue Anodized) | | **Fin Type** | Straight Fin | | **Material** | Aluminum | | **Dimensions** | 45mm x 45mm x 25mm | | **Thermal Resistance** | 5.77 °C/W (@ 100 LFM) | | **Attachment Method** | Push-pin with Brass Spring | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Breakdown of the Part Number ATS uses a specific nomenclature to define the characteristics of their thermal solutions: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **01**: Series designation (Standard push-pin series). * **B**: Material/Process (Aluminum extrusion). * **66**: Size/Geometry code (Specific to the 45x45mm footprint). * **C2**: Thermal Performance/Fin Density (Ranging from C1 to C3). * **R0**: Material finish and ROHS compliance (Blue Anodized). --- ### 3. Key Electronic Functions While the heatsink itself is a passive mechanical part, its role in an electronic circuit is critical for **Thermal Management**: 1. **Heat Dissipation:** It increases the surface area of the semiconductor package, allowing heat to transfer more efficiently into the ambient air via convection. 2. **Protection:** By maintaining the junction temperature ($T_j$) below the manufacturer's limit, it prevents thermal throttling or permanent hardware failure. 3. **Mechanical Attachment:** The "Push-pin" design provides a consistent downward force (pressure) on the chip, ensuring that the Thermal Interface Material (TIM) fills all microscopic air gaps between the chip and the heatsink. --- ### 4. Installation and Usage * **Hole Pattern:** Requires pre-drilled holes on the PCB (Printed Circuit Board). * **Spring Mechanism:** The brass springs ensure that the heatsink remains secure even under vibration or mechanical shock. * **Airflow Dependency:** Because this is a straight-fin design, it performs best in systems with defined **forced-air cooling** (fans) rather than passive natural convection.