The **ATS-01B-58-C2-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions, Inc. (ATS). It is designed to dissipate heat from surface-mount components like CPUs, GPUs, or FPGAs. ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 10.11 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Fin Style** | Fine Pitch (Cross-Cut) | | **Interface Material** | T766 (Thermal Tape) | --- ### 2. Key Components & Design Features #### A. Push-Pin Attachment This model uses a **push-pin and spring** assembly system. * **Purpose:** Provides the necessary pressure to ensure optimal contact between the heat sink and the electronic chip. * **Installation:** Requires pre-drilled holes in the PCB (Printed Circuit Board). #### B. Cross-Cut Fin Design The "Fin-on-Fin" or cross-cut design allows for: * **Multi-directional airflow:** It is effective regardless of which direction the fan is blowing. * **Increased Surface Area:** The gaps between the aluminum fins maximize the contact area with the air to carry heat away faster. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766 thermal tape**. This eliminates the need for manual application of thermal paste, ensuring a consistent and thin layer of conductive material between the chip and the heat sink. --- ### 3. Thermal Performance Comparison Thermal resistance decreases as airflow (measured in Linear Feet per Minute - LFM) increases: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 10.11 | | 300 | 1.5 | 3.47 | | 500 | 2.5 | 2.09 | | 700 | 3.5 | 1.61 | --- ### 4. Part Number Breakdown (Nomenclature) The part number follows a specific logic: * **ATS:** Advanced Thermal Solutions. * **01:** Attachment type (Push-pin). * **B:** Material/Construction. * **58:** Physical footprint/Design ID. * **C2:** Material/Finish (Aluminum/Blue Anodized). * **R0:** Revision/Packaging code.