The **ATS-01B-52-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **heat sink** designed by Advanced Thermal Solutions (ATS) as part of their "push pin" attachment series. --- ### 1. Technical Specifications The following table summarizes the core electronic and physical attributes of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Type** | Top Mount Heat Sink | | **Material** | Aluminum (AL6063) | | **Thermal Resistance** | 10.79°C/W (@ 100 LFM) | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Fin Style** | Straight | | **Surface Finish** | Blue Anodized | --- ### 2. Physical Dimensions Precision measurements are critical for PCB layout integration to ensure no interference with neighboring electronic components: * **Length:** 35.00 mm * **Width:** 35.00 mm * **Height:** 25.00 mm * **Pitch (Mounting Holes):** 40.00 mm --- ### 3. Functional Electronic Role While the heat sink itself does not conduct electricity (it is an "electrically passive" component), it plays a vital role in the reliability of active electronics: 1. **Heat Dissipation:** It is designed to sit atop a BGAs (Ball Grid Array) or other surface-mount ICs (Integrated Circuits) to conduct heat away from the silicon die. 2. **Thermal Performance:** With a height of 25mm and a straight-fin design, it is optimized for systems with defined airflow (convection), reducing the operating temperature of the processor or power regulator. 3. **Mechanical Attachment:** The use of "push pins" ensures a consistent pressure (preload) against the chip, which optimizes the interface with **Thermal Interface Material (TIM)** and prevents the sink from shifting during vibration. --- ### 4. Part Number Breakdown (Nomenclature) Understanding the suffix codes helps in identifying the exact variant: * **ATS:** Manufacturer (Advanced Thermal Solutions) * **01:** Attachment Type (Push-Pin) * **B:** Material/Fin Configuration * **52:** Dimensional code for the 35x35mm footprint * **C2:** Thermal Performance Level / Material Grade * **R0:** RoHS compliant (Lead-free) ---