The **ATS-01B-48-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It is designed for cooling electronic components such as BGA (Ball Grid Array) packages, CPUs, or GPUs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 25.00mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | ~7.50 °C/W (undirected airflow) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Component Features #### A. Attachment Mechanism: Push-Pins The "01B" in the part number indicates a specific push-pin assembly. - **Purpose:** Ensures high pressure against the component for maximum heat transfer. - **Springs:** Usually includes a compression spring to maintain consistent contact over time despite thermal expansion. #### B. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. - This is a high-efficiency phase-change material or thermal grease that fills microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance. #### C. Fin Design - **Straight Fin:** This model uses vertical, straight fins. It is optimized for **forced air cooling** (where a fan is present). The longitudinal channels allow air to flow through the length of the sink to carry away heat. --- ### 3. Part Number Breakdown (Nomenclature) The part number follows the standard ATS naming convention: 1. **ATS**: Manufacturer (Advanced Thermal Solutions). 2. **01B**: Attachment style (Push-pin type). 3. **48**: Specific dimension/geometry code (30x30x25mm). 4. **C2**: Material and Finish (Aluminum, Blue Anodized). 5. **R0**: Revision/RoHS compliance status. --- ### 4. Ideal Applications This heat sink is typically used in: * **Networking Equipment:** Routers, switches, and high-speed modems. * **Industrial PCs:** Compact motherboards where space is limited but height is available. * **Embedded Systems:** Microprocessors generating moderate heat loads in a 30x30mm footprint.