The **ATS-01B-196-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like processors, GPUs, or power modules. --- ### ## Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 45mm x 45mm x 10mm | | **Fin Style** | Straight (Cross-cut) | | **Attachment Method** | Push Pin (Brass) with Compression Spring | | **Thermal Resistance** | 18.11 °C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### ## Electronic Context & Application While the heat sink itself is a passive mechanical part, it plays a critical role in the reliability of electronic systems: 1. **Thermal Management:** It is designed for "Small Form Factor" electronic assemblies where height is restricted (only 10mm tall). 2. **Mounting System:** The push pin mechanism ensures a specific amount of **pressure (clamping force)** is applied to the electronic chip. This ensures the Thermal Interface Material (TIM) fills microscopic gaps between the chip and the heat sink for maximum heat transfer. 3. **Cross-Cut Design:** The fins are cut both ways, making the heat sink "omni-directional." This is vital in electronics where airflow might come from various angles depending on the case fan placement. --- ### ## Comparative Thermal Performance Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): * **Unducted Flow (300 LFM):** ~11.00 °C/W * **Unducted Flow (500 LFM):** ~8.00 °C/W * **Static Pressure:** The spring-loaded pins provide consistent contact, preventing the heat sink from shifting during thermal expansion or vibration. ---