The **ATS-01B-19-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for secure and efficient cooling of electronic integrated circuits (ICs). --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-01B-19-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 9.77°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 54mm x 40mm x 25mm | | **Fin Style** | Straight Fin | --- ### 2. Key Electronic Features #### A. Thermal Dissipation This part is designed to dissipate heat from surface-mount components like CPUs, GPUs, or high-power FPGAs. By increasing the surface area exposed to airflow, it prevents **thermal throttling** or component failure caused by overheating. #### B. Push-Pin Attachment Mechanism The "01B" designation indicates the attachment style. * It uses a **plastic push-pin** with a built-in spring. * This provides a consistent, pre-determined pressure (clamping force) on the electronic chip, ensuring optimal contact with the Thermal Interface Material (TIM). #### C. Material and Coating * **Aluminum:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** Beyond aesthetics, the anodization provides a layer of electrical insulation and increases thermal emissivity, helping the part radiate heat more effectively. --- ### 3. Airflow Performance Data Electronic cooling efficiency varies based on the Linear Feet per Minute (LFM) of airflow provided by system fans: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 9.77 | | 300 | 6.32 | | 400 | 4.97 | | 500 | 4.23 | --- ### 4. Implementation Requirements To use this part in an electronic assembly, the PCB (Printed Circuit Board) must have: 1. **Pre-drilled Holes:** Two holes matching the push-pin pitch of the heat sink. 2. **Thermal Interface Material (TIM):** A thermal pad or grease must be applied between the chip and the heat sink base to eliminate air gaps.