The **ATS-01B-182-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "blue ICE" series, designed primarily for cooling electronic components such as BGA (Ball Grid Array) packages, CPUs, and GPUs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 15.00mm | | **Attachment Method** | Push-Pin (with Compression Springs) | | **Thermal Resistance** | 7.51°C/W (at 100 LFM) | | **Fin Type** | Straight Fin | | **Number of Pins** | 2-Pin mounting | --- ### 2. Key Electronic Components & Design The "electronic" nature of this part relates to its thermal management properties and physical integration onto a Printed Circuit Board (PCB): #### A. Thermal Interface Material (TIM) The model number suffix often indicates the presence of a pre-applied Thermal Interface Material. This ensures maximum heat transfer between the electronic chip (heat source) and the aluminum base by filling microscopic air gaps. #### B. Mechanical Mounting (Push-Pins) Unlike adhesive-based heat sinks, the **ATS-01B-182-C2-R0** uses a mechanical push-pin system: - **Compression Springs:** Provides consistent pressure across the chip surface. - **Reliability:** Protects against vibration and mechanical shock in industrial electronics. - **Serviceability:** Allows the heat sink to be removed for chip maintenance or replacement without damaging the board. #### C. Airflow Optimization The straight-fin design is optimized for **forced convection**. In an electronic enclosure, this part is intended to work in conjunction with a system fan to dissipate heat away from sensitive logic gates. --- ### 3. Usage Examples This part is commonly found in the following electronic systems: 1. **Network Switches:** Cooling high-speed processing chips. 2. **Industrial PCs:** Managing thermals for embedded processors. 3. **Power Supplies:** Dissipating heat from power MOSFETs or bridge rectifiers.