ATS-01B-18-C2-R0
AI

The **ATS-01B-18-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" family, designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits.
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### 1. Technical Specifications
The following table summarizes the physical and thermal properties of this component:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ |
| **Thermal Resistance (Unducted)** | 13.38 °C/W @ 100 LFM |
| **Thermal Resistance (Ducted)** | 3.11 °C/W @ 100 LFM |
| **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 15.00mm |
| **Pitch** | Super Fine |
| **Flow** | XC (Cross-cut) |
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### 2. Key Electronic Features
The "C2" suffix in the part number indicates specific material properties and thermal interface materials (TIM).
* **Thermal Performance:** The super fine pitch design increases the surface area for heat dissipation, making it suitable for high-density electronic assemblies.
* **Thermal Interface Material (TIM):** This model typically comes pre-applied with **T766** phase-change material, which fills microscopic air gaps between the component and the heat sink for maximum heat transfer.
* **Push-Pin Mounting:** Unlike adhesive-based heat sinks, the push-pin mechanism provides a consistent "spring load" force (expressed in Newtons), ensuring reliable thermal contact over the lifetime of the electronic device.
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### 3. Component Identification (Part Number Breakdown)
To understand the specific electronic configuration, the part number is decoded as follows:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **01B** | Product Series (pushPIN™ Heat Sink) |
| **18** | Dimension Code |
| **C2** | Thermal Interface Material (T766) / Blue Anodized |
| **R0** | RoHS Compliant (Lead-free) |
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### 4. Integration Example
When integrating this into a PCB design (e.g., using Altium or Eagle), the mechanical footprint must account for the 47.00mm hole spacing required for the push-pins.
```markdown
# Footprint Requirements
- Board Hole Diameter: 3.175mm (typical for push-pins)
- Hole-to-Hole Distance: 47.00mm (Square pattern)
- Component Keep-out Zone: 54.00mm x 54.00mm
```
- ⤷
What is the specific spring force for the pushPIN mounting mechanism?
- ⤷ Can this heat sink be used with active cooling fans?
- ⤷ How does blue anodizing affect the emissivity and thermal performance?