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  • ATS-01B-18-C2-R0

  • AI
    The **ATS-01B-18-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" family, designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of this component: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance (Unducted)** | 13.38 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 3.11 °C/W @ 100 LFM | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 15.00mm | | **Pitch** | Super Fine | | **Flow** | XC (Cross-cut) | --- ### 2. Key Electronic Features The "C2" suffix in the part number indicates specific material properties and thermal interface materials (TIM). * **Thermal Performance:** The super fine pitch design increases the surface area for heat dissipation, making it suitable for high-density electronic assemblies. * **Thermal Interface Material (TIM):** This model typically comes pre-applied with **T766** phase-change material, which fills microscopic air gaps between the component and the heat sink for maximum heat transfer. * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, the push-pin mechanism provides a consistent "spring load" force (expressed in Newtons), ensuring reliable thermal contact over the lifetime of the electronic device. --- ### 3. Component Identification (Part Number Breakdown) To understand the specific electronic configuration, the part number is decoded as follows: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **01B** | Product Series (pushPIN™ Heat Sink) | | **18** | Dimension Code | | **C2** | Thermal Interface Material (T766) / Blue Anodized | | **R0** | RoHS Compliant (Lead-free) | --- ### 4. Integration Example When integrating this into a PCB design (e.g., using Altium or Eagle), the mechanical footprint must account for the 47.00mm hole spacing required for the push-pins. ```markdown # Footprint Requirements - Board Hole Diameter: 3.175mm (typical for push-pins) - Hole-to-Hole Distance: 47.00mm (Square pattern) - Component Keep-out Zone: 54.00mm x 54.00mm ```
    ✨ Follow-up Questions
    • ⤷ What is the specific spring force for the pushPIN mounting mechanism?
    • ⤷ Can this heat sink be used with active cooling fans?
    • ⤷ How does blue anodizing affect the emissivity and thermal performance?