The part number **ATS-01B-175-C2-R0** refers to a high-performance **heat sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" attachment series designed for cooling electronic components like CPUs, GPUs, and other high-heat chipsets. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 13.52°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 35mm x 35mm x 10mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The alphanumeric code follows a specific nomenclature used by ATS to identify the physical characteristics: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **01B**: Product series (generally referring to the base profile and fin style). * **175**: Specific size/geometry identifier within the series. * **C2**: Material and Finish (typically denotes Blue Anodized Aluminum). * **R0**: Revision or RoHS compliance status. --- ### 3. Key Features and Applications #### Heat Dissipation Design This heat sink uses a **straight-fin design**, which is optimized for systems with directed airflow. The aluminum construction provides a balance between lightweight design and efficient thermal conductivity. #### Mounting System The **Push-Pin and Spring** assembly provides several benefits: 1. **Uniform Pressure:** The compression springs ensure that the heat sink maintains firm, even contact with the component surface. 2. **Tool-less Installation:** Plastic push-pins allow for quick assembly onto a PCB without requiring specialized tools. 3. **Hole Pattern:** Requires pre-drilled holes in the PCB for secure attachment. #### Applications * **Telecommunications:** Cooling of network switches and routers. * **Embedded Systems:** Industrial PCs and small form factor boards. * **Power Electronics:** Voltage regulators and high-speed memory modules. --- ### 4. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 13.52 | | 300 | 1.5 | 6.43 | | 500 | 2.5 | 4.85 |