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  • ATS-01B-147-C2-R0

  • AI
    The **ATS-01B-147-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is specifically designed for cooling electronic components such as BGA (Ball Grid Array) packages, CPUs, and GPUs. ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific component: | Feature | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 10.00mm | | **Thermal Resistance** | 13.52 °C/W (at 100 LFM) | | **Flow Direction** | Straight Fin (Vertical/Horizontal) | --- ### 2. Key Electronic Features #### A. Thermal Management The primary purpose of the ATS-01B-147-C2-R0 is **heat dissipation**. In electronics, high temperatures lead to "thermal throttling" or component failure. The 13.52 °C/W resistance rating indicates how efficiently it transfers heat from the semiconductor junction to the surrounding air. #### B. Push-Pin Attachment Mechanism Unlike adhesive-based heat sinks, this model uses a **spring-loaded push-pin** system. * **Mechanical Stability:** Provides consistent pressure across the interface material (TIM). * **Reliability:** Reduces the risk of the heat sink falling off due to vibration or thermal expansion. * **Pre-drilled Holes:** Requires specific hole patterns on the PCB for mounting. #### C. Straight Fin Design The fins are arranged in a straight-line pattern. This is optimized for: * **Forced Airflow:** Works best in systems with internal fans. * **Low Profile:** At only 10mm high, it is suitable for compact electronics like 1U servers or embedded IoT devices. --- ### 3. Usage Context This part is commonly found in the following electronic applications: 1. **Network Switches:** Cooling high-speed processing chips. 2. **Power Supplies:** Managing heat in MOSFETs or voltage regulators. 3. **Embedded Computing:** Protecting ARM or FPGA chips from overheating in enclosed spaces.
    ✨ Follow-up Questions
    • ⤷ What is the recommended PCB hole pattern for this heat sink?
    • ⤷ How does the 'Blue Anodized' finish affect thermal performance?
    • ⤷ What are the alternatives to push-pin mounting for this size of heat sink?