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  • ATS-01B-08-C3-R0

  • AI
    The **ATS-01B-08-C3-R0** is a specific part number for a **High-Performance Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pins (Plastic/Brass) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm | | **Thermal Resistance** | 14.61°C/W (Natural Airflow) | | **Fin Style** | Straight Fin | | **Spring Type** | Compression Springs | --- ### 2. Breakdown of the Part Number The part number follows a specific naming convention used by ATS to identify the mounting style and size: * **ATS**: Manufacturer prefix (Advanced Thermal Solutions). * **01B**: Refers to the mounting style (Standard Push Pin). * **08**: Unique identifier for the base/footprint size. * **C3**: Indicates the Thermal Interface Material (TIM) pre-applied to the base (usually a high-performance phase-change material). * **R0**: Revision code, often indicating the material type and finish (Aluminum/Blue Anodized). --- ### 3. Electronic Application & Usage In an electronic system, this part serves as a **Passive Cooling Solution**. Its primary functions include: * **Heat Dissipation:** It increases the surface area of a hot component to transfer heat more effectively to the surrounding air. * **Thermal Protection:** By maintaining the junction temperature ($T_j$) of a semiconductor within safe limits, it prevents thermal throttling or permanent hardware failure. * **Secure Attachment:** The push-pin mechanism uses pre-drilled holes in the Printed Circuit Board (PCB), providing consistent pressure between the heat sink and the chip for optimal thermal conductivity. --- ### 4. Thermal Performance Comparison The effectiveness of the ATS-01B-08-C3-R0 depends heavily on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 5.32 | | **400 (2.0 m/s)** | 3.66 | | **600 (3.0 m/s)** | 3.07 | ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for mounting this heat sink?
    • ⤷ Can the C3 thermal interface material be replaced with standard thermal paste?
    • ⤷ How does blue anodization affect the thermal performance compared to bare aluminum?