ATS-01B-08-C3-R0
AI

The **ATS-01B-08-C3-R0** is a specific part number for a **High-Performance Heat Sink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits.
---
### 1. Technical Specifications
The following table outlines the physical and thermal properties of this component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push Pins (Plastic/Brass) |
| **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm |
| **Thermal Resistance** | 14.61°C/W (Natural Airflow) |
| **Fin Style** | Straight Fin |
| **Spring Type** | Compression Springs |
---
### 2. Breakdown of the Part Number
The part number follows a specific naming convention used by ATS to identify the mounting style and size:
* **ATS**: Manufacturer prefix (Advanced Thermal Solutions).
* **01B**: Refers to the mounting style (Standard Push Pin).
* **08**: Unique identifier for the base/footprint size.
* **C3**: Indicates the Thermal Interface Material (TIM) pre-applied to the base (usually a high-performance phase-change material).
* **R0**: Revision code, often indicating the material type and finish (Aluminum/Blue Anodized).
---
### 3. Electronic Application & Usage
In an electronic system, this part serves as a **Passive Cooling Solution**. Its primary functions include:
* **Heat Dissipation:** It increases the surface area of a hot component to transfer heat more effectively to the surrounding air.
* **Thermal Protection:** By maintaining the junction temperature ($T_j$) of a semiconductor within safe limits, it prevents thermal throttling or permanent hardware failure.
* **Secure Attachment:** The push-pin mechanism uses pre-drilled holes in the Printed Circuit Board (PCB), providing consistent pressure between the heat sink and the chip for optimal thermal conductivity.
---
### 4. Thermal Performance Comparison
The effectiveness of the ATS-01B-08-C3-R0 depends heavily on the airflow (measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **200 (1.0 m/s)** | 5.32 |
| **400 (2.0 m/s)** | 3.66 |
| **600 (3.0 m/s)** | 3.07 |
---
- ⤷
What are the PCB hole requirements for mounting this heat sink?
- ⤷ Can the C3 thermal interface material be replaced with standard thermal paste?
- ⤷ How does blue anodization affect the thermal performance compared to bare aluminum?