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  • ATS-01B-01-C3-R0

  • AI
    The **ATS-01B-01-C3-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. This component is part of their "push pin" series, designed for cooling electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications Below is a breakdown of the physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) | | **Dimensions** | 36.83mm x 36.83mm | | **Height** | 5.84mm (Low Profile) | | **Thermal Resistance** | ~14.00°C/W (Natural Convection) | | **Thermal Interface** | T412 (Phase Change Material) | --- ### 2. Design Characteristics This heat sink utilizes a **Straight Fin** design, which is optimized for systems with consistent airflow. * **Low Profile:** With a height of less than 6mm, it is designed for space-constrained applications like blade servers, telecommunications equipment, and compact IoT devices. * **Push Pin Attachment:** It uses a spring-loaded plastic push pin mechanism. This ensures a secure fit with consistent pressure against the electronic chip, improving heat transfer. * **Thermal Interface Material (TIM):** The "C3" suffix indicates it comes pre-applied with a thermal pad or phase-change material, reducing assembly time and ensuring a reliable thermal bond. --- ### 3. Application Use Cases The ATS-01B-01-C3-R0 is typically used in the following electronic environments: 1. **Network Switches/Routers:** Cooling mid-range processors. 2. **Embedded Systems:** For industrial computers where vertical space is limited. 3. **Power Electronics:** Cooling MOSFETs or Voltage Regulators that generate localized heat. --- ### 4. Part Number Breakdown Understanding the nomenclature helps in selecting similar parts: `ATS - 01B - 01 - C3 - R0` * **ATS:** Manufacturer (Advanced Thermal Solutions). * **01B:** Series/Family designator. * **01:** Specific fin height/configuration. * **C3:** Thermal Interface Material (TIM) type. * **R0:** RoHS compliance and packaging revision.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the push pin attachment?
    • ⤷ How does the thermal resistance change with forced air (LFM)?
    • ⤷ Are there copper versions of this heat sink for higher heat loads?