ATS-01B-01-C3-R0
AI

The **ATS-01B-01-C3-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. This component is part of their "push pin" series, designed for cooling electronic components like CPUs, GPUs, and FPGAs.
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### 1. Technical Specifications
Below is a breakdown of the physical and thermal properties of this component:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push Pin (Plastic) |
| **Dimensions** | 36.83mm x 36.83mm |
| **Height** | 5.84mm (Low Profile) |
| **Thermal Resistance** | ~14.00°C/W (Natural Convection) |
| **Thermal Interface** | T412 (Phase Change Material) |
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### 2. Design Characteristics
This heat sink utilizes a **Straight Fin** design, which is optimized for systems with consistent airflow.
* **Low Profile:** With a height of less than 6mm, it is designed for space-constrained applications like blade servers, telecommunications equipment, and compact IoT devices.
* **Push Pin Attachment:** It uses a spring-loaded plastic push pin mechanism. This ensures a secure fit with consistent pressure against the electronic chip, improving heat transfer.
* **Thermal Interface Material (TIM):** The "C3" suffix indicates it comes pre-applied with a thermal pad or phase-change material, reducing assembly time and ensuring a reliable thermal bond.
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### 3. Application Use Cases
The ATS-01B-01-C3-R0 is typically used in the following electronic environments:
1. **Network Switches/Routers:** Cooling mid-range processors.
2. **Embedded Systems:** For industrial computers where vertical space is limited.
3. **Power Electronics:** Cooling MOSFETs or Voltage Regulators that generate localized heat.
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### 4. Part Number Breakdown
Understanding the nomenclature helps in selecting similar parts:
`ATS - 01B - 01 - C3 - R0`
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **01B:** Series/Family designator.
* **01:** Specific fin height/configuration.
* **C3:** Thermal Interface Material (TIM) type.
* **R0:** RoHS compliance and packaging revision.
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What are the PCB hole requirements for the push pin attachment?
- ⤷ How does the thermal resistance change with forced air (LFM)?
- ⤷ Are there copper versions of this heat sink for higher heat loads?