The **ATS-01A-91-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the **pushPIN™** series designed for cooling semiconductor devices like CPUs, FPGAs, and GPUs. --- ### Technical Specifications | Feature | Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions** | 40mm x 40mm x 10mm | | **Thermal Resistance** | 22.00°C/W (Unducted Flow @ 100 LFM) | | **Pin Material** | Brass (Nickel Plated) | --- ### Key Electronic & Physical Components #### 1. Heat Sink Body (The Fin Structure) The body is made of **6063-grade aluminum**, chosen for its high thermal conductivity. It features a "Fine Pitch" or "Straight Fin" design. * **Function:** It increases the surface area available for heat dissipation from the electronic component into the surrounding air. * **Dimensions:** 40mm x 40mm footprint with a low profile (10mm height), making it ideal for compact electronic enclosures. #### 2. Thermal Interface Material (TIM) The "C3" in the part number indicates the type of thermal interface. * **Material:** Pre-applied **T766** thermal grease. * **Function:** It fills microscopic air gaps between the heat sink base and the electronic chip (die/package), significantly reducing thermal resistance. #### 3. Attachment Mechanism (Push-Pin & Spring) Unlike adhesive-based heat sinks, the ATS-01A-91-C3-R0 uses a mechanical attachment system. * **Push-Pin:** Provides a secure, vibration-resistant mount to the PCB. * **Spring:** Ensures consistent "Clamping Pressure," which is critical for maintaining optimal contact between the heat sink and the electronic part over time. --- ### Applications in Electronics This specific part is used in environments where electronic components generate moderate heat and require active or passive airflow cooling: * **Network Switches/Routers:** Cooling high-speed processing chips. * **Power Supplies:** Heat dissipation for MOSFETs and Voltage Regulators. * **Embedded Systems:** Industrial PCs where space is limited but cooling is critical.