The **ATS-01A-91-C2-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for cooling electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number encodes specific data regarding its size, thermal performance, and mounting style: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Anodized Blue) | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Attachment Type** | Push-Pin (Spring Loaded) | | **Thermal Resistance** | Approx. 21.97°C/W (Unducted) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Construction The "electronic parts" aspect of this component focuses on heat dissipation: * **Heat Sink Profile:** It features a **Straight Fin** design. This allows air to flow through the fins efficiently, especially in systems with a defined airflow direction. * **Material Choice:** It is made of **6063 Aluminum**. Aluminum is used for its high thermal conductivity-to-weight ratio, ensuring the component doesn't put excessive physical stress on the PCB. * **Base Surface:** The base is precision-machined to be flat, ensuring maximum surface contact with the electronic component (IC or BGA). --- ### 3. Mounting Mechanism The "R0" at the end of the part number often signifies the attachment method and spring force: 1. **Push-Pins:** Plastic or brass pins that snap into holes on the PCB. 2. **Compression Springs:** These provide a calculated "downward force" (load) to ensure the heatsink stays in contact with the chip, even during mechanical vibration or thermal expansion. 3. **Hole Pattern:** This specific model is designed for a **33mm x 33mm** pitch between the PCB mounting holes. --- ### 4. Typical Applications You will find this part in the following electronic systems: * **Embedded Systems:** Industrial PCs where space is limited. * **Telecommunications:** Cooling of high-speed processors in routers or switches. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. --- ### 5. Thermal Performance Data | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 21.97 | | 300 (1.5 m/s) | 5.33 | | 500 (2.5 m/s) | 3.23 | *Note: As airflow increases, the efficiency of the heatsink improves dramatically.*