ATS-01A-75-C3-R0
AI

The **ATS-01A-75-C3-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It is a high-performance heat sink designed for the thermal management of electronic components such as CPUs, GPUs, or high-power transistors.
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### 1. Technical Specifications
The part number follows a specific nomenclature used by ATS to define its physical and thermal characteristics.
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Fin Type** | Straight Fin |
| **Attachment Method** | Clip-On (push pin or similar mechanism) |
| **Dimensions (L x W x H)** | 25mm x 25mm x 30mm |
| **Thermal Resistance** | Approx. 5.10 °C/W (at 200 LFM) |
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### 2. Key Electronic Components & Design
While the heat sink itself is passive, its design is engineered for specific electronic environments:
* **Thermal Interface Material (TIM):** This part usually comes with a pre-applied high-performance thermal pad or requires thermal paste to bridge the microscopic air gaps between the heat sink and the electronic chip.
* **Fin Geometry:** The straight-fin design is optimized for **forced air cooling** (fans). It allows air to flow through the channels to dissipate heat extracted from the semiconductor junction.
* **Anodized Coating:** The blue anodization is not just for aesthetics; it provides electrical insulation and improves surface emissivity, aiding in radiative heat transfer.
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### 3. Application Use Cases
The ATS-01A-75-C3-R0 is commonly used in the following electronic assemblies:
1. **Telecommunications:** Cooling of signal processing chips in base stations.
2. **Embedded Systems:** Protecting microcontrollers in industrial automation.
3. **Power Electronics:** Dissipating heat from Voltage Regulators or MOSFETs to prevent thermal throttling or hardware failure.
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### 4. Part Number Breakdown
The suffixing in the part number provides additional details:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **01A:** Series designation.
* **75:** Specific height/dimension code.
* **C3:** Material/Finish code (Blue Anodized).
* **R0:** Revision or packaging standard.
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What are the recommended mounting methods for this specific heat sink?
- ⤷ How does the thermal resistance of this part change under natural convection vs. forced airflow?
- ⤷ Are there alternative materials like copper available for this specific footprint?