The **ATS-01A-67-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and power modules. --- ## 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) | | **Dimensions (L x W x H)** | 45mm x 45mm x 10mm | | **Thermal Resistance** | 20.30 °C/W (at 0 LFM / natural convection) | | **Fin Style** | Straight Fin | --- ## 2. Key Electronic & Mechanical Components ### A. Heat Sink Geometry * **Surface Area:** The 45x45mm footprint provides a large surface area for heat dissipation. * **Fin Design:** It uses a straight-fin design, which is optimized for airflow directed across the fins (forced convection). ### B. The Push Pin Mechanism Unlike adhesive-based heat sinks, the "67-C2-R0" uses a **Push Pin and Spring** assembly: 1. **Plastic Push Pins:** Used to secure the heat sink to pre-drilled holes in the Printed Circuit Board (PCB). 2. **Compression Springs:** These ensure a consistent, high pressure between the heat sink and the electronic component, which improves thermal contact. ### C. Interface Material (TIM) The part typically comes with a **Phase Change Material (PCM)** or high-performance thermal pad pre-applied to the base. This fills the microscopic air gaps between the component (e.g., a chip) and the aluminum base to maximize heat transfer. --- ## 3. Applications This specific heat sink is commonly found in the following electronic environments: * **Networking Hardware:** Routers, switches, and gateways. * **Industrial PCs:** Compact motherboards where space is limited. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators (VRMs). --- ## 4. Performance Data (Airflow) The effectiveness of this part scales significantly with airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200** | 4.60 | | **400** | 3.20 | | **600** | 2.50 |