The **ATS-01A-159-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "blue ICE" series, designed specifically for thermal management in electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 20mm | | **Thermal Resistance** | 2.09°C/W @ 200 LFM (Linear Feet per Minute) | | **Mounting Type** | pushPIN™ (Spring-loaded) | | **Attachment Method** | Fine Pitch (straight fins) | --- ### 2. Key Electronic & Physical Components #### A. Thermal Interface Material (TIM) The part number suffix typically indicates the inclusion of a pre-applied **Phase Change Material (PCM)**. This material sits between the heat sink base and the electronic chip to eliminate air gaps, ensuring maximum heat transfer efficiency. #### B. pushPIN™ Attachment System Instead of using adhesive tape or standard screws, this model uses a specialized push-pin system. This consists of: * **Plastic/Brass Pins:** To secure the sink to the PCB. * **Compression Springs:** These provide precise, uniform pressure (Force) across the chip surface, which is critical for protecting delicate silicon dies. #### C. Fin Design (Straight Fin) The fins are designed for **forced air cooling**. Because it uses a "Fine Pitch" straight fin geometry, it is optimized for systems with a directional fan or high-velocity airflow. --- ### 3. Application Use Cases This component is typically found in the following electronic environments: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Computing:** Industrial motherboards and single-board computers (SBCs). 3. **Power Electronics:** Cooling MOSFETs or power regulators in high-density power supplies. --- ### 4. Part Number Breakdown * **ATS:** Advanced Thermal Solutions (Manufacturer). * **159:** Specific series/form factor identifier. * **C2:** Refers to the thermal performance level and material (Aluminum). * **R0:** Revision/Packaging status.